We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Build-up Board.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Build-up Board Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Build-up Board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. キョウデン Nagano//Electronic Components and Semiconductors
  2. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  3. 松和産業 本社 Mie//Electronic Components and Semiconductors
  4. 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 グロース Kanagawa//Electronic Components and Semiconductors
Go to Company Ranking

Build-up Board Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Printed Circuit Board Manufacturing - Build-Up Boards キョウデン
  2. "0201" SMD chip compatible 6-layer (2-2-2) build-up substrate キョウデン
  3. Build-up substrate 三和電子サーキット
  4. 4 Build-up substrate 松和産業 本社
  5. 4 Build-up substrate 松和産業 本社

Build-up Board Product List

1～15 item / All 15 items

Displayed results
[Free Materials Available!] Can't Ask Now! Build-Up Substrate

[Free Materials Available!] Can't Ask Now! Build-Up Substrate

We will provide a free handbook that covers the basic knowledge of build-up substrates, their benefits, and actual case studies!

Do you know what a build-up substrate is and what advantages it has? Recently, with the trend towards miniaturization of products, there has been an increase in ultra-small components such as ICs and capacitors. The demand for smaller printed circuit boards that accommodate these components is rising, and achieving this requires build-up substrates. Kyoden, which has been manufacturing build-up substrates for over 30 years and continues to accumulate know-how, will introduce the basics of build-up, its advantages, and examples of manufacturing achievements! [Contents] ■ What is a build-up substrate? ■ Features of Kyoden's build-up substrates ■ Introduction of case studies, etc. *For more details, please download the PDF or contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board manufacturing service, short delivery time.

Printed circuit board manufacturing service, short delivery time.

IVH, resin filling, build-up, impedance, flexible substrate compatible! Unmatched ultra-short delivery time faster than anywhere else!

Our company manufactures all processes of printed circuit board production in-house. Therefore, we can ship a variety of printed circuit boards with reliable and assured short delivery times. We also handle gold flash, lead-free leveling, and terminal gold plating in-house, which is a characteristic of our company that ensures stable delivery times. Additionally, even for repeat orders, we can accommodate the delivery times listed in the schedule without any changes from the initial order. *Examples of short delivery times: - Through-hole boards (2 to 10 layers): Minimum shipping in 1.05 days* (Data submission and orders by 20:00 on business days will ship the next business day) - Build-up boards: Minimum shipping in 3.1 days* (Data submission and orders by 16:00 on business days will ship on the 3rd business day from the next business day) - Flexible (FPC) boards: Minimum shipping available on the 2nd day - Rigid FPC boards: Minimum shipping available on the 5th day ☆ The above is also applicable even if the surface treatment is gold flash finish. [Products Handled] ■ Through-hole resin-filled boards ■ Build-up boards ■ IVH boards ■ Impedance control boards ■ Copper bump boards ■ Various resist colors ■ Flexible (FPC) boards ■ Rigid FPC boards ■ Copper inlay boards ■ Metal boards *For more details, please feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Build-up substrate

Build-up substrate

All processes are handled in our own factory! Just like other circuit boards, we promise ultra-short delivery times and high quality.

We would like to introduce our "Build-Up Circuit Boards." At Matsuwa Industries, we have also introduced equipment such as CO2 gas laser drilling machines, via-fill copper plating lines, and vacuum hole filling machines. We handle all processes in-house at our factory, even for high-density wiring boards like build-up boards and through resin-filled boards. Of course, just like with other boards, we guarantee ultra-short delivery times and high quality. 【Features】 ■ All processes are manufactured in-house ■ Delivery through 24-hour operations ■ Continuous introduction of new equipment ■ Realization of high-spec boards ■ No fluctuations in gold flash delivery times *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
【Ultra-Short Delivery Time & High Quality】Examples of Printed Circuit Board Manufacturing by Matsuwa Industries

【Ultra-Short Delivery Time & High Quality】Examples of Printed Circuit Board Manufacturing by Matsuwa Industries

We present materials on examples of printed circuit board manufacturing! We introduce examples of non-through vias that achieve thin, compact, and narrow pitch designs, as well as boards that address various thermal issues.

Our company can provide various printed circuit boards with extremely short lead times due to our in-house integrated equipment available 24/7. We have the latest equipment in place, ensuring reliability in inspection and quality. Our track record of over 2,000 transactions is proof of this. 【Examples of Printed Circuit Board Manufacturing】 ◆ Build-up Boards By using non-through vias connected by laser vias, we can achieve thinner, smaller, and narrower pitch boards. ◆ Rigid-Flexible Boards These boards integrate rigid and flexible substrates. They are effective for use in very small spaces, such as in compact modules, or when component placement is limited. ◆ Heat Dissipation Boards These boards address thermal issues, featuring copper inlays and conductive paste resin-filled holes (φ0.6). ★ We are currently offering materials showcasing our printed circuit board manufacturing examples. Please take a look via the "PDF Download" link below.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed Circuit Board Manufacturing - Build-Up Boards

Printed Circuit Board Manufacturing - Build-Up Boards

We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

  • IPROS7280831382280917518.jpg
  • b1.png
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

Corresponding to the 'density' of components! High-frequency build-up substrate.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

  • img0113-1-1-1024x671.jpg
  • img0113-3 (1).jpg
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Build-up substrate

Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

  • ビルドアップ基板2.png
  • ビルドアップ基板3.png
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various inter-layer connections through laser and drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various inter-layer connections through laser and drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Various substrate materials available for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-reliability build-up wiring board

High-reliability build-up wiring board

High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Build-up Board

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.